– by signal: digital, analog (including RF) and mixed-signal;
– by technology nodes: CMOS 28…180 nm, RF CMOS 65…180 nm, SiGe BiCMOS 130…350 nm;
– by structure: from simple devices to Systems-on-Chip;
– by application: from general-purpose ICs to ASSPs and ASICs;
– by frequencies: up to 10 GHz.
We offer electronic modules and complete systems (including schematics, PCB layout, software, mechanical design, user documentation, etc.) development based on its own and third party chips.
Project examples are:
– RF communication device for medical applications
– Navigation receiver module
– Combined GNSS/DTV receiver module for mobile applications
– Railway tracker